大電流固封極柱溫升問(wèn)題分析

 

王小麗¹，楊海鋒²，王鵬¹，紀(jì)江輝¹

（1 許繼集團(tuán)有限公司，河南 許昌 461000；2 許昌許繼風(fēng)電科技有限公司，河南 許昌 461000）

 

    摘 要：固封極柱的固封式結(jié)構(gòu)，導(dǎo)致導(dǎo)電體長(zhǎng)期通電產(chǎn)生的熱量無(wú)法散出，溫升高引起絕緣失效成為固封極柱絕緣失效的主要原因。從影響溫升的主要因素進(jìn)行分析，提出減小主回路電阻、采用導(dǎo)電性好的材料、增加散熱面積等溫升解決方案。通過(guò)固封極柱溫升試驗(yàn)及方案優(yōu)化，驗(yàn)證了解決方案的可行性，并得出軟連接方案在解決大電流固封極柱溫升方面更具有優(yōu)勢(shì)。

    關(guān)鍵詞：固封極柱；主回路電阻；導(dǎo)電材料；散熱面積；軟連接

    中圖分類號(hào)：TM561.2     文獻(xiàn)標(biāo)識(shí)碼：B     文章編號(hào)：1007-3175(2018)11-0056-04

    Abstract: The solid sealing structure of embedded pole leads to not dissipating the heat generated by the long-term conduction of the conductor. The high temperature rising is the main reason for the insulation failure of embedded pole. Based on the analysis of the main factors influencing on the temperature rising, this paper proposed the solutions such as reducing the circuit resistance, using conductive materials with good conductivity and increasing the heat radiation area. Through the temperature rising test and scheme optimization of the solid sealed pole, the feasibility of the scheme was verified.It is concluded that the high-current solid-blocking pole soft connection scheme has more advantages in solving the temperature rising problems.

    Key words: embedded pole; main circuit resistance; conductive materials; heat radiation area; soft connection